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Samsung Taps TSMC for Nvidia's Next-Gen HBM Memory Chips
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Samsung Taps TSMC for Nvidia's Next-Gen HBM Memory Chips

Samsung Electronics will reportedly use rival foundry TSMC's 3nm process to build the base die for Nvidia's custom next-generation memory (NVHBM), the Seoul Economic Daily reported on 18 October 2026, citing industry sources. The move would mark Samsung's first HBM-stage tie-up with TSMC and a shift from its in-house model. None of the three companies has confirmed it. Here's what the report claims, why yield is driving it, and what remains uncertain.

Oct 19 · 6 min

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